Bisphenol A Ethoxylate Dimethacrylate; Bis-EMA

Product Details

CAS No:41637-38-1

MF:(C2H4O)n(C2H4O)nC23H24O4

Appearance:colorless or light-yellow transparent liquid

Specification:98.5%

UN number:-

Package:1/5/10/25kgs/drum

Supply Capacity:KGS

Synonyms:ETHOXYLATED (4) BISPHENOL A DIMETHACRYLATE;ETHOXYLATED (6) BISPHENOL A DIMETHACRYLATE;ETHOXYLATED BISPHENOL A DIMETHACRYLATE;ETHOXYLATED2 BISPHENOL A DIMETHACRYLATE;bisphenol A ethoxylate (2 eo/phenol) dimethacryla;BISPHENOL A ETHOXYLATE (2 EO/PHENOL) DIM ETHACRYLATE, AVERAGE MN CA. 540;Poly(oxy-1,2-ethanediyl), .alpha.,.alpha.-(1-methylethylidene)di-4,1-phenylenebis.omega.-(2-methyl-1-oxo-2-propenyl)oxy-;Ethoxylated bisphenol A dimethacrylate, stabilized

Product application:Bisphenol A Ethoxylate Dimethacrylate,Ethoxylated Bisphenol A Dimethacrylate,Bis-EMA,BPA-EMA,CAS 41637-38-1,UV curable monomer,dimethacrylate crosslinker,photopolymer monomer,dental resin matrix,dental composite raw material,dental bonding agent,dental restorative material,low shrinkage monomer,hydrophobic dimethacrylate,high refractive index monomer,optical clear adhesive LOCA monomer,UV nail gel base resin,soak off gel polish monomer,3D printing photopolymer resin,SLA DLP resin raw material,UV solder mask ink resin,electronic encapsulant monomer,structural acrylic adhesive crosslinker,radiation curable oligomer,high heat resistant monomer,chemical resistant polymer crosslinker,low VOC monomer,Suzhou Health Chemicals Bis-EMA,Bis-EMA manufacturer,Bis-EMA supplier,buy Bis-EMA wholesale

 

Bisphenol A Ethoxylate Dimethacrylate is a premium difunctional reactive crosslinking monomer engineered with a rigid aromatic bisphenol A backbone bridged by flexible ethoxylate segments. Upon free radical or ultraviolet radiation curing, it forms an intensely crosslinked polymer matrix characterized by ultra-low polymerization volume shrinkage, superior mechanical toughness, high refractive index, exceptional hydrophobicity, and outstanding resistance to heat and aggressive chemicals. The compound serves as a foundational resin matrix in restorative dental composites, orthodontic adhesives, pit and fissure sealants, and denture prosthetics, successfully minimizing internal stress while optimizing biocompatibility and flexural modulus. Furthermore, it is extensively formulated into high-precision stereolithography (SLA/DLP) 3D printing photopolymers, advanced UV-curable industrial coatings, solder resist inks, optoelectronic encapsulants, optically clear adhesives, and cosmetic UV-curable soak-off nail gel systems requiring high crosslinking density and long-term durability.