Bisphenol A Glycidylmethacrylate

Basic information

  • Product Name:Bisphenol A Glycidylmethacrylate
  • CAS No.:1565-94-2
  • EINECS No.:216-367-7
  • MF:C29H36O8

Product Specifications

  • Appearance:colorless or light-yellow transparent liquid
  • Specification:98.5%
  • Package:1/5/10/25kgs/drum
  • Supply Capacity:KGS
  • UN number:-
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Product Details

CAS No:1565-94-2

MF:C29H36O8

Appearance:colorless or light-yellow transparent liquid

Specification:98.5%

UN number:-

Package:1/5/10/25kgs/drum

Supply Capacity:KGS

Synonyms:Bisphenol A-Glycidyl Methacrylate (BIS-GMA);Charisma Opal;CN 151;Craynor CN 151;Derakane 411-35;D-GMA;Dion VER 44070-00;Dow 411-35


Product application:Bisphenol A Glycidylmethacrylate,Bis-GMA monomer,CAS 1565-94-2,dental resin raw material,dental composite matrix monomer,Bowen monomer,UV curable dimethacrylate,photopolymer 3D printing resin,dental adhesive monomer,high refractive index methacrylate,low shrinkage oligomer,electronic encapsulant resin,dental restorative formulation,Bis-GMA manufacturer China,Suzhou Health Chemicals Bis-GMA supply,high purity Bis-GMA,dimethacrylate crosslinker,optical grade Bis-GMA,structural adhesive monomer,dental sealants bulk chemicals

 

Bisphenol A Glycidylmethacrylate serves as a premier difunctional crosslinking acrylic monomer, distinguished by its rigid aromatic backbones and highly reactive terminal methacrylate double bonds that ensure rapid free-radical photopolymerization under visible and ultraviolet irradiation. Cured systems exhibit remarkably low volume shrinkage, high compressive and tensile mechanical resistance, long-term chemical durability, and superior refractive index characteristics. The compound operates as an essential base organic matrix in advanced restorative dentistry, broadly incorporated into direct composite restoratives, enamel and dentin bonding systems, pit and fissure sealants, orthodontic adhesives, and prosthetic crown repair formulations; across modern technical sectors, it provides critical mechanical reinforcement and adhesion in precision stereolithography 3D printing formulations, semiconductor encapsulants, optical protective coatings, structural potting compounds, and specialty radiation-curable coatings.